Advanced Materials for Thermal Management of Electronic Packaging

CH. 1. Thermal managing fundamentals and design guide in electronic packaging. - 1. 1 Introduction. - 1. 2 Thermal management challenges and common. - concerns. - 1. 3 Fundamentals of heat transfer. - 1. 4 Thermal management solutions. - 1. 5 Design for advanced thermal management of electronic packaging. - 1. 6 Materials selection for advanced thermal management. - 1. 7 Environmental compliance of thermal managing materials. - CH. 2. Characterization methodology of thermal managing materials. - 2. 1 Thermal properties and measurement techniques. - 2. 2 Electrical properties and measurement techniques. - 2. 3 Thermomechanical characterization. - 2. 4 Analytical techniques for materials characterization. - 2. 5 Surface finish and contact interface compatibility. - 2. 6 Reliability analysis and environmental performance evaluation. - CH. 3. Electronic packaging materials and their thermal managements. - 3. 1 Materials selection for electronic packaging. - 3. 2 Ceramics and semiconductors. - 3. 3 Electronic glasses. - 3. 4 Polymers. - 3. 5 Monolithic metals. - 3. 6 Metallic composites. - 3. 7 Multimaterial laminates. - 3. 8 Printed Circuit Board (PCB) Materials. - 3. 9 Thermal interface materials. - 3. 10 Advanced thermally conductive materials. - CH. 4. THERMALLY conductive carbonaceous materials and carbon matrix composites. - 4. 1 Introduction. - 4. 2 Natural and industrial graphite. - 4. 3 Pyrolytic graphite. - 4. 4 Graphite/Carbon Foams. - 4. 5 Thermally conductive carbon fibers. - 4. 6 Diamond. - 4. 7 Carbon Nanotubes. - 4. 8 Carbon/carbon composites. - CH. 5. Thermally conductive polymer matrix composites. - 5. 1 Introduction. - 5. 2 Polymer matrix types. - 5. 3 Reinforcements selection and its effect on thermal conductivity. - 5. 4 General fabrication and manufacturing processes. - 5. 5 Types and applications for thermal management. - CH. 6. High thermal conductivity metal matrix composites. - 6. 1 Introduction. - 6. 2 Processing of metal matrix composites. - 6. 3 Aluminum matrix composites. - 6. 4 Copper matrix composites. - 6. 5 Other metal matrix composites. - CH. 7. Thermally conductive ceramic matrix composites. - 7. 1 Introduction. - 7. 2 Diamond-SiC composites. - 7. 3 Carbon-SiC Composites. - 7. 4 Reaction-Bonded SiC. - 7. 5 Aluminum-toughened SiC. - 7. 6 CNT/Ceramic- carbon nanotube composites. - CH. 8. Thermal interface materials in electronic packaging. - 8. 1 Thermal contact conductance and requirement for thermal interface materials. - 8. 2 Metallic thermal interface materials. - 8. 3 Thermal grease. - 8. 4 Thermally conductive elastomer materials. - 8. 5 Phase change materials. - 8. 6 Polymer solder hybrid materials. - 8. 7 Fiber-reinforced thermal interface materials. - 8. 8 Graphite based thermal interface material. - 8. 9 Nanotechnology based thermal interface materials. - 8. 10 Thermal interface materials selection. - CH. 9. Materials and design of advanced heat spreader and air cooling heat sink. - 9. 1 Introduction. - 9. 2 Spreading and constriction resistance. - 9. 3 Type of heat spreaders and their materials selection. - 9. 4 Air cooling heat sink. - 9. 4. 1 Heat sink design constraints and design parameters. - 9. 5 Nanostructure heat sink and complex spreader sink. - CH. 10. Liquid cooling devices and materials selection. - 10. 1 Introduction. - 10. 2 Indirect single-phase liquid cooling. - 10. 3 Direct immersion cooling. - 10. 4 Spray cooling and jet impingement. - 10. 5 Heat pipe cooling. - 10. 6 Refrigeration cooling. - 10. 7 High-flux cooling with phase-change heat transfer. - CH. 11. Thermoelectric cooling through thermoelectric materials. - 11. 1 Introduction. - 11. 2 Thermoelectric effects. - 11. 3 Design and architecture of thermoelectric cooling devices. - 11. 4 Thermoelectric materials and future development trends. - CH. 12. Development and applications of advanced thermal managing materials. - 12. 1 Materials development routine and methodology. - 12. 2 Smart composites and multifunctional materials for thermal management. - 12. 3 Thermal managing materials with enhanced EMI shielding and absorbing performance. - 12. 4 Applications. - 12. 5 Future trends. -