Of all the components that go into electronic equipment, the printed circuit probably requires more manufacturing operations-each of which must be per formed by a skilled person-than any other. As a shift supervisor early in my printed circuit career, I had to hire and train personnel for all job functions. The amount of responsibility delegated to my subordinates depended strictly on how well I had been able to train them. Training people can be a trying experience and is always a time-consuming one. It behooved me to help my workers obtain the highest degree of job under standing and skill that they and I were capable of. One hindrance to effective teaching is poor continuity of thought, for example, having to say to a trainee, "Wait a minute; forget what I just told you. We have to go back and do some thing else first. " It was in trying to avoid pitfalls such as this that I undertook a detailed examination of the processes involved, what I thought each trainee had to know, and what questions they would most frequently ask. From this analysis I developed the various process procedures. Only after I had done so was I able to train effectively and with the confidence that I was doing the best possible job. Answers had to be at hand for all of their questions and in what ever detail they needed to know.
Inhaltsverzeichnis
Section 1. Design and Manufacture of Printed Circuits. - 1. How Printed Circuit Boards Are Manufactured: Processes and Materials. - 2. Computer Aided Design and Design Automation. - 3. Digital Printed Circuit Design. - Section 2. Planning, Document Control, and Quality. - 4. Definitions. - 5. Planning. - 6. Quality Assurance Program. - 7. Quality Assurance Manual. - Section 3. Imaging and Artwork. - 8. Artwork Processing. - 9. Artwork Registration Systems for Dry Film Imaging. - 10. Dry Film Imaging. - 11. Screen Printing. - Section 4. N/C Processing. - 12. Numerical Controlled Drilling and Routing. - 12A. Drilling Procedures. - Section 5. Plating and Other Wet Processes. - 13. Metal Thickness Determination. - 14. Amperage Determination. - 15. The Electroless Copper Process 300 Detecting Problems. - 16. Pattern Plating: Copper, Tin-Lead, and Other Metals. - 17. Contact Finger Plating. - 18. Resist Stripping. - 19. Etching. - 20. Tin-Lead Fusing. - Section 6. Multilayer Printed Circuits. - 21. Multilayer Processing. - 22. Etchback and Smear Removal. - Section 7. Process Control. - 23. The Laboratory. - Section 8. The Marketing Program. - 24. Sales Tools. - 25. What Sales People Should Know About Printed Circuits. - Appendix A: Yield Tracking: A Tool for Productivity. - Appendix B: CAD: Swift, Precise, Infinitely Repeatable, but Never Creative. - Appendix C: Soldermask Over Bare Copper: Alternatives and Manufacturing Techniques. - Appendix D: Control and Operation of Printed Circuit Plating Baths with the Hull Cell. - Appendix E: Troubleshooting the IR Fusing Process. - Appendix F: Preserving Solderability with Solder Coatings. - Appendix G: Screen Printing Is the Answer. - Appendix H: Forecasting Waste Treatment Requirements. - Appendix I: Wave Soldering of Discrete Chip Components.
