In modern scanning electron microscopy, sample surface preparation is of key importance, just as it is in transmission electron microscopy. With the procedures for sample surface preparation provided in the present book, the enormous potential of advanced scanning electron microscopes can be realized fully. This will take the reader to an entirely new level of scanning electron microscopy and finely-detailed images never seen before.
Inhaltsverzeichnis
Application Example 1: Lateral Resolution of in-Lens SE and High-Angle BSE Imaging at Low Accelerating Voltages, Below 2. 0 kV. - Application Example 2: Z-Contrast Sensitivity in Low-Voltage, High-Angle BSE Imaging. - Application Example 3: Information Depth in Low-Voltage, High-Angle BSE Imaging. - Application Example 4: Nano Inclusions in Co-Hardened Gold Plating for Electronic Applications #x2013; Further Evidence for High Lateral Resolution in Low-Voltage, High-Angle BSE Imaging. - Application Example 5: A Thin Layer of Organic Contaminant on the Surface of Mirror-Polished Al-Based Hard Disks. - Application Example 6: A Further Potential of Ultralow-Voltage In-lens SE Imaging. - Application Example 7: Sample Surface Preparation by Ultramicrotomy Using a Diamond Knife for Cross-Sectional Examination of Various Coatings on Metals. - Application Example 8: Cross-Sectional Examination of a Galvanized Steel. - Application Example 9: Cross-Sectional Examination of a Painted Steel. - Application Example 10: Cross-Sectional Examination of Solder Joint of the Printed Circuit Board. - Application Example 11: Cross-Sectional Examination of a Tin-Plated Copper Sheet for Electronic Application. - Application Example 12: Cross-Sectional Examination of an Anodized Aluminum Alloy for Aerospace Application. - Application Example 13: Cross-Sectional Examination of a Porous Anodic Oxide Film Grown on a Heterogeneous Al-Fe Alloy. - Application Example 14: Corrosion of an Al 2024-T3 Alloy for Aerospace Application. - Application Example 15: Cross-Sectional Examination of an Etched Al Foil for Capacitor Application. - Application Example 16: On the Nature of rf-GD Sputtering. - Application Example 17: On the Surface Damages Associated with rf-GD Sputtering. - Application Example 18: Precipitates in a Stainless Steel. - Application Example 19: Ferrite Precipitates in a Low-Carbon Stainless Steel. - Application Example 20: A Novel Use of rf-GD Sputtered Surfaces for Oxidation Study of Iron, Nickel, and Copper. - Application Example 21: Preparation of #x201C; Highly Flat and Damage-Free#x201D; Surfaces for High-Resolution Channeling BSE Imaging. - Application Example 22: Oxidation of Sputtered Metal Surface in Air #x2013; The Main Cause of Surface Alternation. - Application Example 23: Microstructure of a Ti Alloy. - Application Example 24: Microstructure of a Ni-Based Super Alloy for Aerospace Applications. - Application Example 25: Cracks in a Nitrogen-Doped Stainless Steel. - Application Example 26: Sample Surface Preparation Using rf-GD Sputtering for Cross-Sectional Examination. - Application Example 27: Cross-Sectional Examination of a Galvanized Steel for Car Bodies. - Application Example 28: Cross-Sectional Examination of a Flash Memory Device. - Application Example 29: Cross-Sectional Examination of a Multilayered Glass. - Application Example 30: Cross-Sectional Examination of a Copper Sheet for Electronic Application. - Application Example 31: Cross-Sectional Examination of a Nitrided Carbon Steel. - Application Example 32: Cross-Sectional Examination of Deformed Surface Regions of Carbon Steel after Shot Peening. - Application Example 33: Cross-Sectional Examination of a Thermal-Sprayed WC-18% Co Coating on a Titanium Alloy. - Application Example 34: Cross-Sectional Examination of a Thermal Barrier Coating on the Ni-based Super Alloy for Aerospace Applications. - Application Example 35: Is EDX Elemental Mapping Really Necessary? . - Application Example 36: Titanium Carbide Precipitates in a Duplex Stainless Steel. - Application Example 37: Adhesion Between the Hard Chromium Coating and Copper Substrate. - Application Example 38: On the Possibility of the Use of rf-GD Sputtering for Follow-Up Treatment of Thin Slices for TEM Examination. - Application Example 39: On 3D Imaging of Semiconductor Devices by FE-SEM. - Concluding Remarks.
