The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Inhaltsverzeichnis
Preface; Materials Research Society symposium proceedings; Part I. Chemical and Di Water Consumption: 1. In situ monitoring of HF reprocessing in an industrial scale A. J. Reddy, G. J. Norga, A. S. Park, A. L. Smith, J. Michel, L. C. Kimerling, B. Parekh, J.-H. Shyu and E. Deane; 2. Anhydrous HF processing as an alternative to HF/water processes J. Staffa, P. Roman, K. Chang, K. Torek and J. Ruzyllo; 3. Minimization of DI water consumption in wet clean rinse tanks J. Cook; 4. The implementation of dilute chemistries in semiconductor manufacturing Ron Sanders, Fuyu Lin and Pat Schay; Part II. Hazardous Gases: 5. PFC emission control options for plasma processing tools: a current assessment M. T. Mocella; 6. Perhalogenated organic byproducts from plasma etching processes and their effects on human health and environmental impact S. Bauer and I. Wolff; 7. Environmental issues of perfluorocompounds in the semiconductor industry Jeffrey D. Williams; 8. Effectiveness of an inwardly fired burner on abatement of PFCs A. M. Pierce and J. Van Gompel; 9. Gas stream analysis and PFC recovery in a semiconductor process J. A. B. Van Hoeymissen, M. Daniels, N. Anderson, W. Fyen and M. Heyns; 10. An integrated approach for the safe handling of hydrides J. R. Shealy, B. Butterfield, D. T. Emerson, K. L. Whittingham, B. L. Pitts and R. R. Bland; 11. Plasma etching of silicon dioxide and silicon nitride with nonperfluorocompound chemistries: trifluoroacetic anhydride and Iodofluorocarbons Simon M. Karecki, Laura C. Pruette and L. Rafael Reif; Part III. Equipment and Process Optimization for ESH: 12. Next generation processes and equipment that lead to positive environment, safety, and health impacts Phyllis Pei and H. Ray Kerby; 13. Parallel downflow rinse: water saving technology in water rinse Y. Hiratsuka and N. Fujikawa; 14. A technique for measuring slurry-flow dynamics during chemical mechanical polishing J. Coppeta, C. Rogers, A. Philipossian and F. Kaufman; 15. A plasma reactor for solid waste treatment on PECVD production systems S. Raoux, M. A. Fodor, W. N. Taylor, D. Cheung and K. Fairbairn; 16. Measurement of arsenic emission from doped Czochraiski silicon crystal growing operation D. Sinha, C. Carlson, Andy Homyak and Elias Hunter; Part IV. Novel Materials for ESH: 17. Chlorine precursors for grate oxidation processes M. J. McGeary, P. W. Mertens, B. Vermeire, M. Heyns, H. Sprey, A. Lubbers and M. Schaekers; 18. Photoresist polymer mask formed from aqueous phase via polymerization in a two-dimensional surfactant template P. D. Newman, G. K. Newman and J. H. Harwell; 19. An integrated chemical-microbiological approach for the disposal of waste thin-film cadmium telluride photovoltaic modules K. M. Paknikar, J. M. Rajwade, A. V. Pethkar, D. J. Goyal, P. G. Bilurkar and N. V. Mate; 20. Point-of-use silicon sources for CVD D. A. Saulys, S. A. Safvi, N. Pauly, J. A. Dopke, B. R. Preston, D. F. Gaines and T. F. Kuech; 21. Safe precursor gas for broad replacement of SiH4 in plasma processes employed in integrated circuit production M. J. Loboda, J. A. Seifferly, C. M. Grove and R. F. Schneider; Author index; Subject index.
