This book provides a comprehensive overview of the recent developments in advanced packaging. Established techniques are discussed, as well as emerging technologies, in order to provide readers with the most up-to-date developments.
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Inhaltsverzeichnis
3D Integration Technologies - An Overview. - Advanced Bonding/Joining Techniques. - Advanced Chip-to-Substrate Connections. - Advanced Wire Bonding Technology: Materials, Methods, and Testing. - Lead-Free Soldering. - Thin Die Production. - Advanced Substrates: A Materials and Processing Perspective. - Advanced Print Circuit Board Materials. - Flip-Chip Underfill: Materials, Process and Reliability. - Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips. - Electrically Conductive Adhesives (ECAs). - Die Attach Adhesives and Films. - Thermal Interface Materials. - Embedded Passives. - Nanomaterials and Nanopackaging. - Wafer Level Chip Scale Packaging. - Microelectromechanical Systems and Packaging. - LED and Optical Device Packaging and Materials. - Digital Health and Bio-Medical Packaging.
